Henkel Technomelt PA 657 Black Encapsulation Hot Melt

Henkel Technomelt PA 657 Black Encapsulation Hot Melt Overview

Henkel Technomelt PA 657 is a high-performance thermoplastic polyamide designed to meet low-pressure molding process requirements. This product can be processed at a low processing pressure due to its low viscosity, allowing the encapsulation of fragile components without damage. This material produces no toxic fumes and provides a good balance of low and high-temperature performance.

Features and Benefits

• Easy moldability
• Good adhesion to a variety of substrates
• Cold temperature flexibility
• Excellent moisture resistance

Specifications

• Series: Technomelt PA 657 Black
• Type: Hot Melt Adhesive
• Application: Molding
• Chemistry: Polyamide
• Components: One-Component
• Cure: Physical Setting
• Appearance: Black
• Molding Temperature: 356°F to 446°F (180°C to 230°C)
• Operating Temperature Range: -40°F to 212°F (-40°C to 100°C)
• Softening Point: 302°F to 329°F (150°C to 165°C)
• Melting Viscosity:
  • Approx. 8,600 cps @ 356°F (180°C)
  • Approx. 6,500 cps @ 374°F (190°C)
  • Approx. 4,900 cps @ 392°F (200°C)
  • Approx. 3,000 cps to 4,500 cps @ 410°F (210°C)
• Specific Gravity @ 68°F (20°C): 0.98 g/cm³
• Shore A Hardness: 77
• Yield Strength: 375 psi (2.6 N/mm²)
• Break Strength: 390 psi (2.7 N/mm²)
• Elongation: 350%
• Temperature Creep Resistance: 257°F (125°C)
• Low Temperature Flexibility: -58°F (-50°C)
• Water Absorption (1 Day) 1.4% @ (23°C)
• Glass Transition Temperature (Tg) -49°F (-45°C)